VIA optronics Proposed IPO in the US

VIA optronics AG, a 76%-owned German subsidiary of Integrated Microelectronics Inc. (PSE: IMI) and a leading supplier of enhanced display solutions, filed on 4 September 2020, a Registration Statement on Form F-1 with the U.S. Securities and Exchange Commission relating to a proposed initial public offering of its American Depositary Shares (ADSs) representing ordinary shares in the capital of the Company. The number of ordinary shares to be represented by each ADS, the number of ADS to be offered and the price range for the proposed offering have not yet been determined. The Company has applied to list its ADSs on the New York Stock Exchange under the ticker symbol VIAO.

Berenberg will act as sole bookrunning manager for the proposed offering. A registration statement relating to the securities has been filed with the U.S. Securities and Exchange Commission but has not yet become effective. This press release or disclosure is not an offer of securities for sale in the United States. The securities may not be offered or sold in the United States absent registration or an exemption from registration. Any public offering of securities to be made in the United States will be made by means of a prospectus that may be obtained, when available, from the Company or IMI and that will contain detailed information about the Company and management, as well as financial statements.

VIA is a leading provider of enhanced display solutions for multiple end markets in which superior functionality or durability is a critical differentiating factor. Its customizable technology is well-suited for high-end markets with unique specifications as well as demanding environments that pose technical and optical challenges for displays, such as bright ambient light, vibration and shock, extreme temperatures and condensation. VIA’s Interactive Display Systems combine system design, interactive displays, software functionality, cameras and other hardware components. VIA’s intellectual property portfolio, process know-how, and optical bonding and metal mesh touch sensor and camera module technologies provide enhanced display solutions that are built to meet the specific needs of its customers.



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